Impumelelo yamva nje yophuhliso lweemodyuli zokupholisa ze-thermoelectric
I. Uphando oluPhambili kwiZixhobo kunye neMida yokuSebenza
1. Ukuqiniswa kwengcamango ethi “iglasi ye-phonon – ikristale ye-elektroniki”: •
Impumelelo yamva nje: Abaphandi bakhawulezise inkqubo yokuvavanya izinto ezinokubakho ezine-lattice thermal conductivity ephantsi kakhulu kunye ne-Seebeck coefficient ephezulu ngokusebenzisa i-high-throughput computing kunye nokufunda koomatshini. Umzekelo, bafumanise ii-Zintl phase compounds (ezifana ne-YbCd2Sb2) ezinezakhiwo zekristale ezintsonkothileyo kunye nee-cage-shaped compounds, ezinexabiso le-ZT elidlula elo le-Bi2Te3 yendabuko ngaphakathi kwemigangatho ethile yobushushu. •
Icebo "lobunjineli be-Entropy": Ukwazisa ukuphazamiseka kokwakheka kwezinto kwii-alloys ezine-entropy ephezulu okanye izisombululo eziqinileyo ezinamacandelo amaninzi, ezisasaza kakhulu ii-phonon ukunciphisa kakhulu ukuhanjiswa kobushushu ngaphandle kokubeka emngciphekweni iipropati zombane, kube yindlela entsha esebenzayo yokuphucula umfanekiso we-thermoelectric of merit.
2. Ukuqhubela phambili kweMida kwiZakhiwo eziPhantsi kunye neziNano:
Izixhobo ze-thermoelectric ezinemilinganiselo emibini: Izifundo kwi-single-layer/monolayer SnSe, MoS₂, njl. zibonise ukuba isiphumo sazo sokuvalelwa kwe-quantum kunye neemeko zomphezulu zinokukhokelela kwi-power factors ephezulu kakhulu kunye ne-thermal conductivity ephantsi kakhulu, nto leyo enika ithuba lokwenziwa kwee-micro-TEC ezincinci neziguquguqukayo. iimodyuli zokupholisa ze-micro thermoelectric, ii-micro peltier coolers (ii-Micro peltier elements).
Ubunjineli bojongano lwesikali seNanometer: Ukulawula ngokuchanekileyo izakhiwo ezincinci ezifana nemida yeenkozo, ukusasazeka, kunye nokutshintsha kwe-nano-phase, njenge "izihluzi ze-phonon", zisasaza ngokukhetha abathwali bobushushu (ii-phonon) ngelixa zivumela ii-electron ukuba zidlule kakuhle, ngaloo ndlela ziphula ubudlelwane bendabuko bokudibanisa iiparameter ze-thermoelectric (ukuqhuba, i-Seebeck coefficient, ukuqhuba kobushushu).
II. Ukuphononongwa kweendlela ezintsha zokufaka iifriji kunye nezixhobo
1. Ukupholisa okusekwe kwi-thermoelectric:
Le yindlela entsha eguqukayo. Ngokusebenzisa ukufuduka kunye nokuguqulwa kwesigaba (okufana ne-electrolysis kunye nokuqina) kwee-ions (endaweni yee-electron/imingxuma) phantsi kwentsimi yombane ukuze kufunyanwe ubushushu ngokufanelekileyo. Uphando lwamva nje lubonisa ukuba ii-ionic gels ezithile okanye ii-electrolytes ezingamanzi zinokuvelisa umahluko omkhulu kakhulu kubushushu kunee-TEC zemveli, ii-peltier modules, ii-TEC modules, ii-Thermoelectric coolers, kwii-voltages eziphantsi, zivula indlela entsha ngokupheleleyo yophuhliso lwetekhnoloji yokupholisa yesizukulwana esilandelayo eguquguqukayo, engathethiyo, nesebenza kakuhle kakhulu.
2. Iinzame zokunciphisa i-aturation yefriji kusetyenziswa amakhadi ombane kunye namakhadi oxinzelelo: •
Nangona ingelulo uhlobo lwempembelelo ye-thermoelectric, njengetekhnoloji ekhuphisanayo yokupholisa imeko eqinileyo, izixhobo (ezifana neepolymers kunye neeceramics) zinokubonisa utshintsho olukhulu kubushushu phantsi kwamacandelo ombane okanye uxinzelelo. Uphando lwamva nje luzama ukunciphisa nokucwangcisa izixhobo ze-electrocaloric/pressurcaloric, kwaye luqhube uthelekiso olusekelwe kumgaqo kunye nokhuphiswano ne-TEC, i-peltier module, i-thermoelectric cooling module, kunye nesixhobo sePeltier ukuze kuhlolwe izisombululo ze-micro-cooling ezinamandla aphantsi kakhulu.
III. Imida yoHlanganiso lweNkqubo kunye noBuchule bokuSebenza
1. Ukudibanisa i-on-chip yokusasaza ubushushu "kwinqanaba le-chip":
Uphando lwamva nje lugxile ekudibaniseni i-micro TEC, imodyuli ye-thermoelectric encinci， (imodyuli yokupholisa ye-thermoelectric), izinto ze-peltier, kunye neetships ezisekwe kwi-silicon ngendlela efanayo (kwitship enye). Kusetyenziswa itekhnoloji ye-MEMS (Micro-Electro-Mechanical Systems), ii-micro-scale thermoelectric column arrays zenziwe ngokuthe ngqo ngasemva kwetship ukubonelela ngokupholisa okusebenzayo "kwe-point-to-point" ngexesha langempela kwiindawo ezishushu zasekuhlaleni ze-CPUs/GPUs, okulindeleke ukuba ziphule i-thermal bottleneck phantsi koyilo lwe-Von Neumann. Oku kuthathwa njengenye yezisombululo zokugqibela kwingxaki "yodonga lobushushu" lweetships zamandla ekhompyutha zexesha elizayo.
2. Ulawulo lobushushu oluzisebenzela ngokwalo kwii-elektroniki ezinxitywayo neziguquguqukayo:
Ukudibanisa imisebenzi emibini yokuvelisa umbane we-thermoelectric kunye nokupholisa. Impumelelo yamva nje ibandakanya ukuphuhliswa kweefayibha ze-thermoelectric eziguquguqukayo nezinokolulwa kunye namandla aphezulu. Ezi azinakuvelisa umbane kuphela kwizixhobo ezinxitywayo ngokusebenzisa umahluko wobushushu， kodwa kwakhona kufezekiswe ukupholisa kwendawo (njengokupholisa iiyunifomu zomsebenzi ezikhethekileyo) ngokusebenzisa umbane obuyela umva， ukufikelela kulawulo oludibeneyo lwamandla kunye nobushushu.
3. Ulawulo oluchanekileyo lobushushu kwitekhnoloji ye-quantum kunye ne-biosensing:
Kwimimandla yanamhlanje efana nee-quantum bits kunye nee-sensors ze-high-sensitivity, ulawulo lobushushu oluchanekileyo kakhulu kwinqanaba le-mK (millikelvin) lubalulekile. Uphando lwamva nje lugxile kwiinkqubo ze-TEC ezinamanqanaba amaninzi, i-multi-stage peltier module (i-thermoelectric cooling module) ezichanekileyo kakhulu (± 0.001°C) kwaye luhlola ukusetyenziswa kwe-TEC module, isixhobo se-peltier, i-peltier cooler, yokurhoxisa ingxolo esebenzayo, ijolise ekudaleni indawo enobushushu obuzinzileyo kakhulu kwiiplatifomu ze-quantum computing kunye nezixhobo zokufumanisa i-single-molecule.
IV. Ubuchule kwiTekhnoloji yokulinganisa kunye nokuphucula
Uyilo oluqhutywa buBukrelekrele bokwenziwa: Ukusebenzisa i-AI (efana neenethiwekhi ezivelisayo ezichaseneyo, ukufunda kokuqinisa) kuyilo olubuyela umva "lwesakhiwo-ukusebenza kwezinto", ukuxela kwangaphambili ulwakhiwo lwezinto ezininzi olufanelekileyo, oluneziqendu kunye nejometri yesixhobo ukufezekisa i-coefficient ephezulu yokupholisa ngaphakathi kobubanzi bobushushu obubanzi, okunciphisa kakhulu umjikelo wophando nophuhliso.
Isishwankathelo:
Impumelelo yophando lwamva nje lwe-peltier element, i-thermoelectric cooling module (i-TEC module) isuka "ekuphuculeni" ukuya "ekuguqulweni". Iimpawu eziphambili zezi zilandelayo: •
Inqanaba lezinto: Ukusuka kwi-bulk doping ukuya kwi-atomic-level interfaces kunye nolawulo lwe-entropy engineering.
Kwinqanaba elisisiseko: Ukusuka ekuxhomekekeni kwii-elektroni ukuya ekuhloleni ii-charge carriers ezintsha ezifana nee-ion kunye nee-polaron.
Inqanaba lokudibanisa: Ukusuka kwizinto ezahlukeneyo ukuya ekudibaniseni okunzulu neetships, amalaphu, kunye nezixhobo zebhayoloji.
Inqanaba ekujoliswe kulo: Ukusuka ekupholiseni kwinqanaba elikhulu ukuya ekusombululeni imingeni yolawulo lobushushu betekhnoloji yanamhlanje efana ne-quantum computing kunye ne-optoelectronics edibeneyo.
Olu phuculo lubonisa ukuba iitekhnoloji zokupholisa i-thermoelectric zexesha elizayo ziya kusebenza kakuhle ngakumbi, zenziwe zibe mfutshane, zibe krelekrele, kwaye zihlanganiswe nzulu kwisiseko setekhnoloji yolwazi yesizukulwana esilandelayo, i-biotechnology, kunye neenkqubo zamandla.
Ixesha lokuthumela: Matshi-04-2026
