Ukususela ngo-2025, iteknoloji yeThermoelectric Cooling (TEC) yenze inkqubela phambili emangalisayo kwizixhobo, uyilo lwesakhiwo, ukusebenza kakuhle kwamandla kunye neemeko zokusetyenziswa. Ezi zilandelayo ziindlela zamva nje zophuhliso lwetekhnoloji kunye neempumelelo ezikhoyo ngoku.
I. Ukuphuculwa okuqhubekayo kwemigaqo ephambili
Isiphumo sePeltier sihlala sisisiseko: ngokuqhuba ii-semiconductor pairs ze-N-type/P-type (ezifana nezinto ezisekwe kwiBi₂Te₃) ngombane othe ngqo, ubushushu buyakhutshwa kwicala elishushu buze bufunxwe kwicala elibandayo.
Amandla okulawula ubushushu obuhamba ngamacala amabini: Ingapholisa/ifudumeza ngokutshintsha nje indlela yangoku, kwaye isetyenziswa kakhulu kwiimeko zokulawula ubushushu obuchanekileyo.
II. Uphuhliso kwizakhiwo zezinto eziphathekayo
1. Izixhobo ezintsha zombane
I-Bismuth telluride (Bi₂Te₃) isasele iyinto eqhelekileyo, kodwa ngobunjineli be-nanostructure kunye nokwenza ngcono i-doping (njenge-Se, Sb, Sn, njl.njl.), ixabiso le-ZT (i-optimal value coefficient) liphuculwe kakhulu. I-ZT kwezinye iisampuli zelebhu ingaphezulu kwe-2.0 (ngokwesiko malunga ne-1.0-1.2).
Uphuhliso olukhawulezileyo lwezixhobo ezizezinye ezingenalo ilothe/ezingenatyhefu ingako
Izixhobo ezisekwe kwi-Mg₃(Sb,Bi)₂
Ikristale enye ye-SnSe
I-alloy ye-Half-Heusler (efanelekileyo kwiindawo ezishushu kakhulu)
Izinto ezidityanisiweyo/i-gradient: Izakhiwo ezahlukeneyo ezinamalaya amaninzi zinokuphucula ukuhanjiswa kombane kunye nokuhanjiswa kobushushu ngaxeshanye, zinciphisa ukulahleka kobushushu beJoule.
III, Utshintsho kwinkqubo yolwakhiwo
1. Uyilo lwe-thermopile ye-3D
Sebenzisa ulwakhiwo oludibeneyo lwe-stacking oluthe nkqo okanye olune-micro channel ukuphucula uxinano lwamandla okupholisa kwindawo nganye yeyunithi.
Imodyuli ye-cascade TEC, imodyuli ye-peltier, isixhobo se-peltier, imodyuli ye-thermoelectric inokufikelela kumaqondo obushushu aphantsi kakhulu angama--130℃ kwaye ifanelekile kuphando lwesayensi kunye nokukhenkcezwa kwezonyango.
2. Ulawulo oluyimodyuli nolukrelekrele
I-sensor yobushushu edibeneyo + i-algorithm ye-PID + i-PWM drive, ifikelela kulawulo lobushushu oluchanekileyo ngaphakathi kwe-±0.01℃.
Ixhasa ulawulo olukude nge-Intanethi yezinto, ifanelekile kwi-cold chain ekrelekrele, izixhobo zelebhu, njl.
3. Ukwenziwa ngcono kolawulo lobushushu ngokusebenzisana
Ukudluliselwa kobushushu okuphuculweyo ekupheleni kokubanda (i-microchannel, i-PCM yezinto zokutshintsha isigaba)
Isiphelo esishushu sisebenzisa ii-graphene heat sinks, ii-Vapor chambers okanye ii-micro-fan arrays ukusombulula ingxaki "yokuqokelelana kobushushu".
IV, iimeko zesicelo kunye namasimi
Unyango kunye nokhathalelo lwempilo: izixhobo ze-thermoelectric PCR, izixhobo zobuhle ze-thermoelectric cooling laser, iibhokisi zothutho ezifrijiweyo zevaccine
Unxibelelwano olubonakalayo: Ulawulo lobushushu bemodyuli ye-optical ye-5G/6G (ukuzinzisa ubude be-laser)
Izixhobo ze-elektroniki zabathengi: Iikliphu zokupholisa iifowuni eziphathwayo, ukupholisa ii-headset ze-thermoelectric AR/VR, iifriji ezincinci zokupholisa ze-peltier, i-thermoelectric cooling wine cooler, iifriji zeemoto
Amandla amatsha: Ikhabhathi yobushushu obuhlala buhleli kwiibhetri zedrone, ukupholisa kwasekuhlaleni kwiikhabhathi zezithuthi zombane
Itekhnoloji ye-aerospace: ukupholisa ngobushushu be-thermoelectric kwe-satellite infrared detectors, ulawulo lobushushu kwindawo engenamxhuzulane kwizikhululo zasesibhakabhakeni
Ukwenziwa kwee-semiconductor: Ulawulo lobushushu oluchanekileyo kwiimashini ze-photolithography, amaqonga ovavanyo lwe-wafer
V. Imingeni yoBugcisa yangoku
Ukusebenza kakuhle kwamandla kusephantsi kunoko kwe-compressor friji (i-COP idla ngokuba ngaphantsi kwe-1.0, ngelixa ii-compressors zinokufikelela kwi-2-4).
Ixabiso eliphezulu: Izixhobo ezisebenza kakuhle kunye nokupakishwa okuchanekileyo kunyusa amaxabiso
Ukusasazwa kobushushu kwicala elishushu kuxhomekeke kwinkqubo yangaphandle, ethintela uyilo oluncinci
Ukuthembeka kwexesha elide: Ukujikeleza kwe-thermal kubangela ukudinwa kwamalungu e-solder kunye nokonakala kwezinto
VI. Isikhokelo soPhuhliso lweXesha elizayo (2025-2030)
Izixhobo zombane ezisebenzisa ubushushu begumbi ezine-ZT > 3 (Ukuphumelela komda wethiyori)
Izixhobo ze-TEC eziguquguqukayo/ezinxitywayo, iimodyuli ze-thermoelectric, iimodyuli ze-peltier (zesikhumba se-elektroniki, ukujonga impilo)
Inkqubo yolawulo lobushushu oluhambelanayo kunye ne-AI
Iteknoloji yokuvelisa nokuhlaziya ngendlela eluhlaza (Ukunciphisa iNyathelo leNdalo)
Ngowama-2025, iteknoloji yokupholisa i-thermoelectric isuka "kulawulo lobushushu oluchanekileyo noluchanekileyo" ukuya "kwisicelo esisebenzayo nesibanzi". Ngokudityaniswa kwesayensi yezinto, ukucubungula i-micro-nano kunye nolawulo olukrelekrele, ixabiso layo elicwangcisiweyo kwiinkalo ezifana nokufrijiwa kwe-zero-carbon, ukusasazwa kobushushu be-elektroniki okuthembekileyo okuphezulu kunye nolawulo lobushushu kwiindawo ezikhethekileyo kuya kugqama ngakumbi.
Inkcazelo ye-TES2-0901T125
Ubungakanani: 1A,
Umax: 0.85-0.9V
Ubuninzi beQ: 0.4 W
Ubuninzi beDelta T:>90 C
Ubungakanani: Ubungakanani besiseko: 4.4×4.4mm, ubungakanani obuphezulu: 2.5X2.5mm,
Ukuphakama: 3.49 mm.
Iinkcukacha zeTES1-04903T200
Ubushushu obushushu ecaleni bungama-25 C,
Ubungakanani: 3A,
Umax:5.8 V
Ubuninzi beQ: 10 W
Ubuninzi beDelta T:> 64 C
I-ACR: 1.60 Ohm
Ubungakanani: 12x12x2.37mm
Ixesha leposi: Disemba-08-2025
