Iqhutywa kukwanda ngokukhawuleza kweemfuno zamandla ekhompyutha ye-AI, imfuno yee-coolers ze-micro-thermoelectric (ii-Micro-TEC) inyuke kakhulu ngo-2026. Njengoko amaziko edatha aqhutywa yi-AI exhomekeke ngakumbi kwii-optical interconnects eziphezulu, amashumi amawaka eemodyuli ze-optical kwisixhobo ngasinye ngoku zithumela imithamo emikhulu yedatha ngesantya esiphantse silingane nokukhanya. Olu kukhula lusekelwe ngokusisiseko kwimingeni yokulawula ubushushu eyandayo enxulunyaniswa nokuqhubela phambili koxinano lwekhompyutha—ingakumbi kwiziseko zophuhliso ze-AI—apho ulawulo oluchanekileyo lobushushu luye lwaba yinto ebalulekileyo ekuthembekeni kwenkqubo, ukuthembeka kwesignali, kunye nobude bexesha lesixhobo. Le mingeni ibonakala kwiindawo ezine eziphambili zesicelo:
1. Uthumelo lwe-Long-haul backbone: Iimodyuli ze-optical ze-Dense wavelength division multiplexing (DWDM)—ezikwaziyo umgama wothumelo odlula i-80 km—zifuna iiMicro-TEC (iimodyuli ze-micro thermoelectric, iimodyuli ze-Micro peltier) ukugcina uzinzo lobushushu be-laser diode ngaphakathi kokunyamezelana okuqinileyo, ngaloo ndlela zithintela ukushukuma kwe-wavelength kunye nokuqinisekisa ukwahlulwa kwe-spectral channel kwiinethiwekhi eziphambili.
2. Amaziko edatha asebenza kakuhle: Kwiiklusta zoqeqesho lwe-AI kunye nezibonelelo ze-cloud computing, ii-high-integrated photonic integrated circuits (PICs) zivelisa ubushushu obukhulu bendawo. Ii-Micro-TEC, i-Micro thermoelectric cooling module, ii-Micro peltier elements zibonelela nge-thermoregulation enamandla, yexesha langempela ukugcina amaqondo obushushu afanelekileyo okusebenza kwiinkqubo zekhompyutha kunye nezonxibelelwano.
3. Iziseko zonxibelelwano ze-5G/6G: Izitishi zesiseko zangaphandle zisebenza phantsi kotshintsho olukhulu lobushushu obuphakathi (umz., −40 °C ukuya ku-+85 °C). Ii-Micro-TEC, izixhobo ze-Micro peltier, ii-micro-peltier coolers zivumela ulawulo lobushushu olujikelezayo—ukupholisa ngexesha lobushushu obuphakathi kunye nokufudumeza ngexesha leemeko ezingaphantsi kwe-zero—ukuqinisekisa ukusebenza kwemodyuli ye-optical engaphazanyiswayo kuzo zonke iindawo zokusebenza.
4. Iinkqubo zonxibelelwano lwe-optical ezihambelanayo: Kwiinethiwekhi ze-fiber-optic zedolophu enkulu, indawo ebanzi, kunye neenqanawa ezingaphantsi komhlaba, ii-transceivers ezihambelanayo zibeka iimfuno ezingqongqo zozinzo lwesigaba kunye ne-polarization kwizibonakaliso ze-optical. Ii-Micro-TEC, ii-Micro-peltier modules, ii-micro thermoelectric coolers zibonelela ngozinzo lobushushu oluphantsi kwe-millikelvin-ezibalulekileyo ekugcineni ukuthembeka kokufumanisa okuhambelanayo kunye nokunciphisa amazinga e-bit error (BER).
5. Unxibelelwano olubalulekileyo kwimizi-mveliso nakwinjongo: Kwiimeko ezinzima—kuquka ukwenziwa kwezinto ngokuzenzekelayo kwimizi-mveliso, iinkqubo zokujonga, kunye nokusetyenziswa kweenqwelo-moya—iiMicro-TEC, izinto ze-micro peltier ziqinisekisa ukusebenza kakuhle kwemodyuli ye-optical kumanqanaba obushushu obude (−40 °C ukuya ku-+105 °C), okuxhasa ukuthembeka kokusebenza kwexesha elide.
I. Ulawulo oluchanekileyo lobushushu njengomqhubi oyintloko wokukhula
Iimodyuli ze-optical ezikhawulezayo—ingakumbi ezo zisebenza kwi-800G, 1.6T, kunye namazinga edatha e-3.2T aphumayo—zinobuthathaka kakhulu kwiingxaki zobushushu. Ii-laser diodes zibonisa ukuxhomekeka kobushushu obungaphakathi, zibangela ukuwohloka kokusebenza okukhawulezayo:
• Ukushukuma kweWavelength: Iilaser zeDistributed feedback (DFB), umzekelo, zibonisa i-coefficient eqhelekileyo ye-wavelength-temperature ye ~0.1 nm/°C. Ngaphezulu koluhlu lokusebenza kwezorhwebo (0–70 °C), oku kuthetha ukuya kuthi ga kwi-7 nm yokutshintsha kwe-spectral—ukudlula isithuba se-channel kwiinkqubo ezininzi ze-DWDM kunye nokukhuthaza i-crosstalk phakathi kwe-channel kunye ne-BER escalation.
• Ukungazinzi kwamandla okubonakalayo: Ukutshintshatshintsha kobushushu kuguqula ngokuthe ngqo ukusebenza kakuhle komda welaser kunye nokusebenza kakuhle kweslope, okubangela ukwahluka kwamandla okuphuma kunye nomlinganiselo wesignali-kwingxolo (SNR).
• Ukuguga kwesixhobo ngokukhawuleza: Ukusebenza ixesha elide ngaphandle kwe-optimal thermal envelope kukhawulezisa iindlela zokubola—kuquka i-facet oxidation kunye nokwanda kwe-quantum well defect—kunciphisa ixesha eliphakathi ukuya ekusileleni (MTTF).
Ngenxa yezi zithintelo, iimodyuli ze-optical zesizukulwana esilandelayo ze-AI zigunyazisa ukuchaneka kokuqina kobushushu be-±0.05 °C okanye ngaphezulu—iimfuno ezinokuthi kuphela iiMicro-TEC, izixhobo ze-micro peltier, iimodyuli ze-micro TEC, iimodyuli ze-micro thermoelectric ezinokwaneliswa ngaphakathi kwezinto ezixineneyo (<3 mm² footprint) kunye namaxesha okuphendula angaphantsi kwe-100 ms. Ngenxa yoko, phantse zonke iimodyuli ze-800G+ eziphakathi neziphezulu zidityaniswe neenkqubo zolawulo lobushushu ezivaliweyo eziquka iiMicro-TEC, iimodyuli ze-Micro-TEC, izixhobo ze-micro peltier, ii-thermistors ze-micro TE ezichanekileyo, kunye nee-IC zolawulo lobushushu ezizinikeleyo—ngokusebenzayo “zivala” ubushushu be-laser junction ukuya ngaphakathi kwe-±0.02 °C yendawo emiselweyo.
Ixabiso lokusebenza leMicro-TECs, iimodyuli zokupholisa ze-thermoelectric ezincinci, izinto ze-thermoelectric ezincinci kwiimodyuli ze-optical ziquka imilinganiselo emithathu exhomekeke kwenye:
• Uzinzo lweSpectral: Ukuthintela okusebenzayo kokushukuma kwewavelength kuqinisekisa ukuhambelana kwesiteshi, kususa i-crosstalk, kwaye kugcina i-BER ephantsi phantsi kwemithwalo yobushushu enamandla;
• Ukulungiswa kokuthembeka kwesignali: Ukupholisa/ukufudumeza okuguquguqukayo kulungisa ii-thermal transients ezibangelwa yi-ambient kunye ne-load-induced, kuzinzisa amandla okukhanya kunye nokuphucula ubunzulu be-modulation kunye ne-extinction ratio;
• Ulwandiso lobomi bonke: Ukukhupha ubushushu ngokufanelekileyo kunciphisa ukuqokelelwa koxinzelelo lobushushu, kulibazise ukuwohloka kwezinto kwaye kunciphisa amazinga okusilela kwentsimi ukuya kuthi ga kwi-40% (ngedatha yovavanyo lobomi ekhawulezileyo).
II. Ukulinganiswa kwe-Exponential kwe-Micro-TEC, iimodyuli ze-micro peltier deployment nge-AI server nganye
Iiseva zoqeqesho lwe-AI zanamhlanje zihlala zidibanisa iimodyuli ze-optical ezikhawulezayo ezili-16-32—nganye ifuna ii-Micro-TEC ezi-2-3, iimodyuli ze-micro thermoelectric (iimodyuli zokupholisa ze-micro thermoelectric) kuxhomekeke kwisantya sedatha, uyilo lokupakisha (umz., ii-optics ezipakishwe kunye, i-CPO), kunye nomda woyilo lwe-thermal. Ngenxa yoko, iseva enye ye-AI ephezulu inokubandakanya ii-Micro-TEC ezingama-40-90 (izinto ze-Micro-peltier)—ezimele ukonyuka kwe-5-10× ngaphezu kweeseva zeshishini eziqhelekileyo. Njengoko ukuthunyelwa kweemodyuli ze-optical ze-800G/1.6T zehlabathi jikelele kulindeleke ukuba kudlule iiyunithi ezili-15 lezigidi ngonyaka ngo-2026, imfuno iyonke ye-Micro-TEC yee-AI clusters ze-petabyte-scale kulindeleke ukuba ifikelele kumashumi ezigidi zeeyunithi ngonyaka.
III. Ukuvela koyilo lwe-hybrid liquid cooling + Micro-TEC (iimodyuli zokupholisa ze-micro thermoelectric)
Njengoko ii-accelerator ze-AI zesizukulwana esilandelayo—kuquka iqonga le-GB300 le-NVIDIA—zityhala ii-envelopes zamandla e-GPU ngaphaya kwe-1,000 W ngedayi, izisombululo zokupholisa umoya zifikelele kwimida ye-thermodynamic esisiseko kwi-rack density deployments. Ngoko ke, ukupholisa ulwelo kuye kwaba ngumgangatho oqhelekileyo wolawulo lobushushu be-rack kunye ne-chassis. Ngaphakathi kolu cwangciso, kuye kwavela icebo lokupholisa ngokwenqanaba: ukupholisa ulwelo kuphatha ukususwa kobushushu obuninzi kwinqanaba lenkqubo, ngelixa ii-Micro-TEC (ii-micro peltier coolers) zenza ulawulo lobushushu olucolekileyo, olukumgangatho we-chip—olwenza ukuba ubushushu bufane ngendlela engakaze ibonwe ngaphambili kwii-photonic kunye nee-electronic dies. Olu lwakhiwo oluhambelanayo lubeka ii-Micro-TEC, iimodyuli ze-micro-thermoelectric njengesixhobo esibalulekileyo—hayi nje icandelo elincedisayo—kwi-AI computing thermal stacks.
IV. Ukutshintshwa ngokukhawuleza kwezixhobo zasekhaya phakathi kwemida yokubonelela ngeenkonzo kwihlabathi liphela
Ngokwembali, ngaphezulu kwama-80% eeMicro-TECs ezichanekileyo kakhulu, izixhobo zeMicro thermoelectric (iimodyuli zeMicro TEC) zazibonelelwa ngabavelisi baseJapan. Nangona kunjalo, ukunyuka kwemfuno enxulumene ne-AI kuye kwandisa amaxesha okukhokela kubaboneleli abakhoyo—abanye badlula iiveki ezingama-26—kwaye kwanciphisa ulwabiwo lwamandla kubathengi abanobuchule. Abavelisi beemodyuli zeTEC zaseTshayina basekhaya basebenzisa eli nqanaba lokunyuka: ukukhawulezisa imijikelo yokufaneleka ye-AEC-Q200 kunye neTelcordia GR-468 kunye nabathengisi beemodyuli ze-optical zeTier-1, ukwandisa amandla emveliso yenyanga ukuya kumanqanaba eeyunithi ezizigidi ezininzi, kunye nokufikelela kumlinganiselo wokusebenza (± 0.03 °C uzinzo, >1.2 W/mm² uxinano lokupholisa) kunye nabalingani abaphambili bamazwe ngamazwe.
Ngamafutshane, ukudibana kwe-AI computing density breakthroughs, i-bandwidth escalation, kunye ne-photonics integration industrials kunyuse iiMicro-TEC (ii-Micro peltier modules) ukusuka kwi-peripheral thermal components ukuya kwi-baseal infrastructure elements. Ngoku zisebenza "njengemfuneko engabonakaliyo" - into engabonakaliyo kodwa engabalulekanga yokumisela ixesha lokusebenza kweziko ledatha le-AI, i-computational throughput, kunye neendleko ezipheleleyo zobunini bexesha elide.
I-Beiing Huimao Cooling Equipment Co.,Ltd. inamava angaphezu kwamashumi amathathu eminyaka kuyilo kunye nokuveliswa kweemodyuli zokupholisa ze-micro-thermoelectric, i-Micro-TECS, inkampani yethu iphumelele ukuphuhlisa ipotifoliyo eyahlukeneyo yezisombululo zokupholisa ze-thermoelectric ezincinci ezenzelwe iinkcukacha zabathengi bamazwe ngamazwe. Ezi mveliso zisasazwa ngokubanzi kwi-aerospace, izixhobo zonyango, unxibelelwano lwe-optical, kunye nezicelo zoshishino ezichanekileyo. Siyamkela intsebenziswano enobuchule namaqabane ehlabathi jikelele yobunjineli kunye nophuhliso oludibeneyo lwetekhnoloji yokupholisa ye-thermoelectric yesizukulwana esilandelayo.
Inkcazelo yeTES1-00401T200
Ubushushu obusecaleni obushushu: 50 C,
Ubungakanani: 0.8A，
Ubuninzi beV: 0.48V
Ubuninzi beQ: 0.3W
Ubuninzi beDelta T: 76 C
I-ACR: 0.5 Ohm
Ubungakanani: 2.3 × 1.1 × 0.95mm
Ixesha lokuthumela: Agasti-11-2026
