I-micro thermoelectric cooler (Micro TEC), ekwabizwa ngokuba yi-micro thermoelectric cooling module, i-Micro-peltier module, i-Micro peltier element, yamkelwe ngokubanzi kumacandelo amaninzi e-high-tech ngenxa yeempawu zayo ezibonakalayo kunye nokuhambelana okuphezulu kobunjineli.

I-micro thermoelectric cooler (Micro TEC), ekwabizwa ngokuba yi-micro thermoelectric cooling module, i-Micro-peltier module, i-Micro peltier element, yamkelwe ngokubanzi kumacandelo amaninzi e-high-tech ngenxa yeempawu zayo ezibonakalayo kunye nokuhambelana okuphezulu kobunjineli. Usetyenziso lwayo oluphambili lugxile kwiindawo ezifuna iikhrayitheriya zokusebenza ezingqongqo—kubandakanya ukuzinza kobushushu, impendulo ekhawulezayo yobushushu, ukuxinana kwendawo, kunye nokuhambelana kwe-electromagnetic—unxibelelwano olubonakalayo, ii-elektroniki zabathengi, izixhobo ze-biomedical, ii-elektroniki zeemoto, iinkqubo ze-aerospace kunye nokhuselo, kunye nezixhobo zokuchaneka kwemizi-mveliso.

I. Unxibelelwano lwe-Optical (iSicelo esiPhambili seStrategic)

Ii-Micro TECs, iimodyuli ze-Micro thermoelectric, izixhobo ze-Micro peltier zisebenza njengezixhobo ezibalulekileyo zokulawula ubushushu kwii-laser kwii-transceivers ze-optical ezikhawulezayo (umz., ii-10G, 25G, 100G, 400G, kunye ne-800G modules). Ngokugcina ubushushu be-laser junction ngaphakathi kwe-±0.1°C, zithintela ngempumelelo ukushukuma kwe-wavelength kunye ne-crosstalk phakathi kweendlela, ngaloo ndlela ziqinisekisa ukuthembeka kwesignali kunye nokuthembeka ekudlulisweni kwedatha ye-bandwidth ephezulu. Imfuno ekhulayo yokunxibelelana kwe-optical okuphantsi, okuphezulu-okuqhutywa ziziseko zekhompyutha ezinzulu ze-AI kumaziko edatha kunye namaqela oqeqesho lwe-AI-kuye kwakhawulezisa kakhulu ukukhula kwemarike ye-Micro TEC (i-micro peltier module). Ngelixa izisombululo eziphezulu zisalawulwa ziinkokeli zehlabathi ezifana neFerrotec kunye ne-KELK, abavelisi basekhaya benza inkqubela phambili eqhubekayo ekuphuculeni iinkqubo zezinto ze-thermoelectric, ubuchwepheshe bokupakisha be-hermetic, kunye nobuchule bokudibanisa kwinqanaba lenkqubo, okwenza kube lula ukwenziwa kwendawo ngokuthe ngcembe kodwa okuhlala ixesha elide kweekhonkco zokubonelela.

II. Izixhobo ze-elektroniki zabathengi

IiMicro TECs, iiMicro thermoelectric cooling modules (miniature peltier module) ziyanda ukusetyenziswa kwizisombululo zolawulo lobushushu kwizixhobo eziphathekayo nezincinci—kuquka ii-smartphone assistant cooling clamps, ii-desktop thermoelectric water dispensers (hot/cold), ii-micro-scale PCR instruments, kunye nee-mini-refrigerators ezisebenzisa i-USB. Uyilo lwazo oluqinileyo—olubonakala ngokuba zizinto ezinganyakaziyo, ukungcangcazela okuncinci, ingxolo ye-acoustic ephantsi kakhulu, kunye nezinto ezingaphantsi kwe-millimeter form factors—zihambelana ngokusondeleyo nezinto ezibalulekileyo zoyilo kwi-electronics zabathengi: i-miniaturization, ukusebenza buthule, kunye nokuhlanganiswa okungenamthungo.

III. Izixhobo zeBiomedical

Ukuxilongwa kwe-in vitro (IVD) kunye namaqonga esayensi yobomi axhomekeke kwiimodyuli zeMicro thermoeletric, izinto zeMicro peltier, iiMicro TEC, izinto ze-miniature peltier ukuze kubekho ulawulo oluchanekileyo nolunamandla lobushushu:

(1) Kwiinkqubo ze-real-time quantitative polymerase chain reaction (qPCR), ii-Micro TECs, ii-Micro thermoelectric modules (ii-Micro TEC modules) zivumela i-millisecond-scale thermal cycle (isantya sokufudumeza ≥ 3°C/s; izinga lokuphola ≥ 2°C/s), ukuqinisekisa ukucaciswa kokwandiswa kunye nokuphindaphinda kovavanyo;

(2) Izikhongozeli zokuthutha eziphathwayo zemixokelelwane ebandayo zamayeza kunye neegonyo zigcina umgangatho wokusebenza ozinzileyo we-2–8°C, zihlangabezana neemfuno ze-WHO zangaphambili zokufaneleka kwempahla elawulwa bubushushu;

(3) Kwi-hematology kunye ne-clinical chemistry analyzers, ukupholisa okucwangcisiweyo kwe-CCD/CMOS image sensors (uluhlu lokusebenza: −10°C ukuya ku-+5°C) kunciphisa kakhulu ingxolo yamandla amnyama kwaye kuphucula umlinganiselo wesignali-kwingxolo;

(4) Kwizixhobo zonyango ezibonisa ubuhle—kuquka iinkqubo zokususa iinwele nge-laser ezisekelwe kwi-semiconductor kunye namaqonga okukhanya okushukuma okunamandla (IPL)—ii-Micro peltier coolers, ii-Micro TECs, ii-micro thermoelectric cooling modules, zibonelela ngokupholisa i-epidermal ukuphucula ukhuseleko lonyango, ukusebenza kakuhle, kunye nentuthuzelo yesigulana.

IV. Izixhobo zombane zeemoto

Ngenxa yokwanda kwezithuthi eziqhagamshelweyo ezikrelekrele kunye neenkqubo zoncedo lomqhubi eziphambili (i-ADAS), iimodyuli zeMicro TEC, iiMicro TEC, iimodyuli zeMiniature thermoelectric zisetyenziselwa imbuyekezo yobushushu kwiiyunithi zeLiDAR transmitter/receiver, ukuqinisekisa ukusebenza okubonakalayo rhoqo kwiimeko ezishushu kakhulu (−40°C ukuya ku-+85°C). Zikwadityaniswe kwiinkqubo eziphantsi zolawulo lwemozulu yekhabhini, ezifana neefriji ezikrelekrele ezifakwe kwizithuthi. Zine-12 V DC input, ukusetyenziswa kwamandla aphantsi (< 5 W eqhelekileyo), ukomelela okuphezulu koomatshini (ukungcangcazela kunye nokumelana nomothuko), kunye ne-ultra-compact footprint (< 10 mm²), iimodyuli zeMicro thermoelectric, iimodyuli zeMicro peltier, iimodyuli zokupholisa zeMicro thermoelectric (iimodyuli zemicro thermoelectric) zihlangabezana nokuthembeka okuqinileyo kwinqanaba leemoto kunye neemfuno zoyilo oluxinzelelweyo lwesithuba.

V. Inqwelo-moya kunye noKhuselo

IiMicro TECs, izixhobo zeMicro peltier zibonakalise ukusebenza ngempumelelo kwi-in-orbit kwiinkqubo zolawulo lobushushu besathelayithi. Umzekelo, iiyunithi eziphuhliswe apha ekhaya zaqinisekiswa kwisithuthi sokuqalisa i-"Lianjian-1", okuvumela ukulawulwa kobushushu okusebenzayo kwe-elektroniki ebalulekileyo kwimishini-kuquka iimodyuli zonxibelelwano lwe-optical ezikwibhodi kunye ne-infrared focal plane arrays-kwindawo enzima. Ukongeza, zixhasa izixhobo zokubona i-infrared emoyeni kunye neenkqubo ze-CCD zokujonga umoya ezikumgangatho wesayensi, apho uzinzo olukhethekileyo lobushushu lubalulekile kwi-remote sensing ephezulu kunye nokuchonga iithagethi ngokuchanekileyo.

VI. Izixhobo Zokuchaneka Kwemizi-mveliso

Izicelo eziphambili ziquka:

(1) Uzinzo lobushushu lwemithombo yefayibha kunye ne-laser ekhawulezayo (uzinzo ≤ ± 0.05°C), ukuqinisekisa ukuhambelana kwamandla okukhupha kunye nokuthembeka komgangatho we-beam;

(2) Ukupholisa ngokunzulu i-mercury cadmium telluride (MCT) okanye i-HgCdTe infrared detectors kwi-thermal imagers kunye ne-spectroscopic analyzers (ukuya kuthi ga kwi-−40°C), okunciphisa kakhulu ingxolo yobushushu kunye nokuphucula uvakalelo lokufumanisa;

(3) Ukusebenza kwe-cryogenic kweekhamera ze-CMOS zesayensi ezisetyenziswa ekujongeni izinto zeenkwenkwezi kunye nokuhlolwa kweziphene ze-semiconductor wafer, apho umbane omnyama oncitshisiweyo uvumela amaxesha okuvezwa ande kunye nokuthembeka okuphezulu komfanekiso;

(4) Iimodyuli zokuthintela ukufuma kweekhabhathi zolawulo lombane kwiindawo ezinomswakama ophezulu, zisebenzisa ukupholisa okukufutshane ukulawula ngokukhutheleyo indawo yokubanda nokuqinisekisa ukuthembeka kokusebenza kwexesha elide.

Ukungakhethi cala kobuchwephesha kunye nokungathathelwa indawo kwe-Micro TEC, micro thermoelectric module kuvela kwi-solid-state Peltier effect, enika uluhlu lweenzuzo ezihambelanayo:

• Ulawulo olunamandla oluphezulu lobushushu: ixesha lokuphendula kobushushu elikwi-millisecond; ukuchaneka kokulawula ubushushu obuzinzileyo kungcono kune-±0.1°C;

• Ukusebenza okuthuleyo, okungenangcangcazelo: ukungabikho kwezinto ezijikelezayo okanye ezitshintshanayo—ezilungele ukusetyenziswa kwezixhobo zokujonga, ukuva, kunye nemifanekiso;

• Ukwenziwa kube lula kakhulu kunye nokukwazi ukuyifaka: kuhambelana nokupakisha i-chip-on-board (COB) kunye nokuhlanganiswa kwe-hermetic ngaphakathi kwezixhobo, okuvumela ulawulo lobushushu olukwindawo engaphantsi kwe-millimeter;

• Uzinzo lokusingqongileyo: ukusebenza ngaphandle kwefriji; akukho kukhutshwa kwezinto eziphelisa i-ozone okanye iigesi ezigcina ubushushu; kuhambelana ngokupheleleyo nemigangatho yeRoHS kunye neREACH.

Iinkcukacha zeTES2-2402T200

Ubushushu obushushu ecaleni buyi-27 C,

Ubungakanani: 1.4A,

Umax:1.98V

Ubuninzi beQ:> 0.7 W

I-ACR: 1.35 ±0.1 Ω

Ubuninzi beDelta T: 99 C

Ubungakanani: Ubungakanani besiseko: 6.6×6.6 mm, ubungakanani obuphezulu: 4X4mm,

Ukuphakama: 4.9±0.1mm.

Intambo: 28 AWG ubude bentambo yesinyithi: 45.7 mm